The migration of a design integrating external IP is dependent upon the engineering and financial resources of the IP provider to develop, release (on a testsite shuttle), characterize, and qualify the IP on a new node on a suitable schedule. The new N5 process is set to offer a full node increase over the 7nm variants, and uses EUV technology extensively over 10+ layers, reducing the total steps in production over 7nm. TSMCs extensive use, one should argue, would reduce the mask count significantly. Heres how it works. The only available facts are: "-- J.Huang stated in December, that most of the new GPUs will be manufactured at TSMC, Samsung will only handle the smaller part", TSMC Details 3nm Process Technology: Full Node Scaling for 2H22 Volume Production, TSMC To Build 5nm Fab In Arizona, Set To Come Online In 2024, TSMC & Broadcom Develop 1,700 mm2 CoWoS Interposer: 2X Larger Than Reticles, TSMC Boosts CapEx by $1 Billion, Expects N5 Node to Be Major Success, Early TSMC 5nm Test Chip Yields 80%, HVM Coming in H1 2020, TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm, TSMC: N7+ EUV Process Technology in High Volume, 6nm (N6) Coming Soon. TSMC was a natural partner since they do not compete with customers and Apple was a VERY big customer when this all started (2014). An 80% yield would mean 2602 good dies per wafer, and this corresponds to a defect rate of 1.271 per sq cm. @DrUnicornPhD @anandtech https://t.co/2n7ndI0323, I don't believe I've mentioned this explicitly in public, but I promoted him to Senior CPU Editor last month. N6 strikes me as a continuation of TSMCs introduction of a half node process roadmap, as depicted below. At 16/12nm node the same processor will be considerably larger and will cost $331 to manufacture. All rights reserved. A yield rate of 32.0% for a 100 mm2 chip would even be sufficient for some early adopters wanting to get ahead of the game. ), The adoption rate for the digital dashboard cockpit visualization system will also increase, driving further semiconductor growth 0.2% in 2018 to 11% in 2025.. You must log in or register to reply here. Windows 11 Update Brings New Search Box, But AI Integration is Hype, U.S. Govt Outlines Requirements for CHIPS Act Subsidies, Nvidia's 531.18 Driver Adds RTX Video Super Resolution Support, Gigabyte Aorus 15X Review: Raptor Lake and RTX 4070 Impress, AMD Ryzen 9 7950X3D and 7900X3D: Where to Buy. You can thank Apple for that since they require a new process every year and freeze the process based on TTM versus performance or yield like the other semiconductor manufacture giants. https://www.anandtech.com/show/16028/better-yield-on-5nm-than-7nm-tsmc-update-on-defect-rates-for-n5. Why are other companies yielding at TSMC 28nm and you are not? The only fear I see is anti trust action by governments as Apple is the world's largest company and getting larger. TSMC continues to deepen its investments in research and development, with $2.96 billion invested in 2019 alone, and the company is building a new R&D center staffed with 8,000 engineers next to the company headquarters. This plot is linear, rather than the logarithmic curve of the first plot. TSMC is also working to define its next node beyond N3 and shared some of the industry advances that could help it move beyond 3nm, but didn't provide any specifics of which technologies it would employ. As far as foundry sale price per patterned 300-mm wafer is concerned, the model takes into account such things as CapEx, energy use, depreciation, assembly, test and packaging costs, foundry operating margins, and some other factors. Does it have a benchmark mode? Significant device R&D is being made to enhance the device ft and fmax for these nodes look for 16FFC-RF-Enhanced in 2020 (fmax > 380GHz) and N7-RF-Enhanced in 2021. Suffi https://t.co/VrirVdILDv, Now that I've finally had a chance to catch my breath (and catch up on my sleep), a big kudos to @gavbon86 for maki https://t.co/Sddmfr0UtE. The N4 enhancement to the 5nm family further improves performance, power efficiency and transistor density along with the reduction of mask layers and close compatibility in . TSMC is actively promoting its HD SRAM cells as the smallest ever reported. Compared with N7, N5 offers substantial power, performance and date density improvement. Apple is TSM's top customer and counts for more than 20% revenue but not all. For higher-end applications, 16FFC-RF is appropriate, followed by N7-RF in 2H20. I double checked, they are the ones presented. The first products built on N5 are expected to be smartphone processors for handsets due later this year. When you purchase through links on our site, we may earn an affiliate commission. The Technology Symposium event was recently held in Santa Clara, CA, providing an extensive update on the status of advanced semiconductor and packaging technology development. TSMC claims the N5 process offers up to 15% more performance (at the same power) or 30% power reduction at the same performance, and a 1.8X logic density gain over the 7nm N7 process. For TSMC at least, certain companies may benefit from exclusive rights to certain DTCO improvements, to help those companies get additional performance benefits. For everything else it will be mild at best. Perhaps in recognition of the difficulties in achieving L3 through L5, a new L2+ level has been proposed (albeit outside of SAE), with additional camera and decision support features. Nvidia IS on TSMC, but they're obviously using all their allocation to produce A100s. For the combined chip, TSMC is stating that the chip consists of 30% SRAM, 60% Logic (CPU/GPU), and 10% IO. The model is based on an imaginary 5nm chip the size of Nvidia's P100 GPU (610 mm2, 90.7 billion transistors at 148.2 MTr/mm2). The 16nm and 12nm nodes cost basically the same. You are using an out of date browser. The N7 platform will be (AEC-Q100 and ASIL-B) qualified in 2020. TSMC. So, the next time you hear someone say, that process is not yielding, be sure to stop them and ask: Are you sure? Recent reports state that ASML is behind in shipping its 2019 orders, and plans to build another 25-27 in 2020 with demand for at least 50 machines. Those are screen grabs that were not supposed to be published. N7+ is benefitting from improvements in sustained EUV output power (~280W) and uptime (~85%). "The D0 improvement ramp has been faster than previous nodes, at a comparable interval after initial production volume ramp.", according to TSMC. N10 to N7 to N7+ to N6 to N5 to N4 to N3. But the point of my question is why do foundries usually just say a yield number without giving those other details? But what is the projection for the future? design rule compatible with N7 (e.g., 57mm M1 pitch, same as N7), incorporates EUV lithography for limited FEOL layers 1 more EUV layer than N7+, leveraging the learning from both N7+ and N5, tighter process control, faster cycle time than N7, same EDA reference flows, fill algorithms, etc. . This means that current yields of 5nm chips are higher than yields of . . Although the CAGR for cars from now to 2022 is expected to be only ~1.8%, the CAGR for the semiconductor content will be 6.9%., He continued, The L1/L2 feature adoption will reach ~30%, with additional MCUs applied to safety, connectivity, and EV/hybrid EV features. A 256 Mbit SRAM cell, at 21000 nm2, gives a die area of 5.376 mm2. . Visit our corporate site (opens in new tab). @gavbon86 I haven't had a chance to take a look at it yet. For sub-6GHz RF front-end design, TSMC is introducing N40SOI in 2019 the transition from 0.18um SOI to 0.13um SOI to N40SOI will offer devices with vastly improved ft and fmax. @ChaoticLife13 @anandtech Swift beatings, sounds ominous and thank you very much! Defect density is numerical data that determines the number of defects detected in software or component during a specific development period. This slide from TSMC was showcased near the start of the event, and a more detailed graph was given later in the day: This plot is linear, rather than the logarithmic curve of the first plot. https://lnkd.in/gdeVKdJm I have no clue what NVIDIA is going to do with the extra die space at 5nm other than more RTX cores I guess. In conversing with David Schor from Wikichip, he says that even the 32.0% yield for 100 mm2 calculated is a little low for risk production, unless youre happy taking a lot of risk.). For 10nm they rolled out SuperFIN Technology which is a not so clever name for a half node. The defect density distribution provided by the fab has been the primary input to yield models. Knowing the yield and the die size, we can go to a common online wafer-per-die calculator to extrapolate the defect rate. According to TSMC, its N5 has a lower defect density than N7 at the same time of its lifespan, so chip designers can expect that eventually N5-based chips will yield better than N7-based ICs. I found the snapshots of TSM D0 trend from 2020 Technology Symposium from Anandtech report(. We will support product-specific upper spec limit and lower spec limit criteria. This node offers full node scaling over N5 and will bring up to a 10-15% performance improvement or 25-30% power reduction paired with an (up to) 1.7X density improvement. For over 10 years, packages have also offered two-dimensional improvements to redistribution layer (RDL) and bump pitch lithography. Ultimately its only a small drop. Burn Lin, senior director of TSMC's micropatterning division, claims the company has produced multiple test wafers with defect rates as low as three per wafer, according to . I need to ponder a bit more on the opportunity use M0 as a routing layer TSMC indicated that EDA router support for this feature is still being qualified. I asked for the high resolution versions. TSMC listed nanosheets and nanowires among the advances, along with new materials, like high mobility channels, 2D transistors, and carbon nanotubes as candidates that it is already researching. The flip side is that the throughput of a single EUV machine (175 wafers per hour per mask) is much slower than a non-EUV machine (300 wafers per hour per mask), however the EUVs speed should be multiplied by 4-5 to get a comparison throughput. The defect density distribution provided by the fab has been the primary input to yield models. 2023 White PaPer. Looks like N5 is going to be a wonderful node for TSMC. Interesting. The TSMC RF CMOS offerings will be used for SRR, LRR, and Lidar. The 16FFC platform has been qualified for automotive environment applications e.g., SPICE and aging models, foundation IP characterization, non-volatile memory, interface IP. You must register or log in to view/post comments. Also read: TSMC Technology Symposium Review Part II. Actually mild for GPU's and quite good for FPGA's. Here is a brief recap of the TSMC advanced process technology status. For this chip, TSMC has published an average yield of ~80%, with a peak yield per wafer of >90%. One could point to AMDs Zen 2 chiplet as more applicable chip, given it comes from a non-EUV process which is more amenable to moving to 5nm EUV, however something like this will come later and will use high performance libraries to not be as dense. ), (Note initially when I read it the first time, I saw this only in the context of the 5.376 mm2 SRAM-only die. For now, head here for more info. TSMCs latest N5 (5nm) fabrication process appears to be particularly expensive on per-wafer basis because it is new, but its transistor density makes it particularly good for chips with a high transistor count. (For anyone wanting to compare this defect density to the size of Zen 2 chiplet at 10.35x7.37mm, that equates to 41.0% yield. The N7 capacity in 2019 will exceed 1M 12 wafers per year. Another dumb idea that they probably spent millions of dollars on. By continuing to use the site and/or by logging into your account, you agree to the Sites updated. The three main types are uLVT, LVT and SVT, which all three have low leakage (LL) variants. The gains in logic density were closer to 52%. TSMC N5 from almost 100% utilization to less than 70% over 2 quarters. Inverse Lithography Technology A Status Update from TSMC, TSMCs 28-nm process in trouble, says analyst, Altera Unveils Innovations for 28-nm FPGAs, TSMC Offers the Industrys Most Successful FinFET Technology to Academia, TSMC Holds 3nm Volume Production and Capacity Expansion Ceremony, Marking a Key Milestone for Advanced Manufacturing, TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations, TSMC Japan 3DIC RD Center Completes Clean Room Construction in AIST Tsukuba Center, Silicon Topology Joins TSMC Design Center Alliance (DCA), TSMC FinFlex, N2 Process Innovations Debut at 2022 North America Technology Symposium, Kura Technologies Partners with TSMC to Build the Future of the Metaverse, TSMC Holds Equipment Engineer Workshop to Strengthen Industry-academia Collaboration. Clearly, the momentum behind N7/N6 and N5 across mobile communication, HPC, and automotive (L1-L5) applications dispels that idea. In reality these still Are about 40 to 54 nm in reality correct me if I am wrong , isnt true 3nm impossible to reach ? I find there isn't https://t.co/E1nchpVqII, @wsjudd Happy birthday, that looks amazing btw. Only thing up in the air is whether some ampere chips from their gaming line will be produced by samsung instead. Today at the IEEE IEDM Conference, TSMC is presenting a paper giving an overview of the initial results it has achieved on its 5nm process. This process is going to be the next step for any customer currently on the N7 or N7P processes as it shares a number design rules between the two. This means that chips built on 5nm should be ready in the latter half of 2020. 3nm is two full process nodes ahead of 5nm and only netting TSMC a 10-15% performance increase? In that chip are 256 mega-bits of SRAM, which means we can calculate a size. The technology is currently in risk production, with high volume production scheduled for the first half of 2020. In order to determine a suitable area to examine for defects, you first need . These were the nodes that Pascal and Turing were on respectively, yet NVIDIA wanted to add around 60% more transistors between the GP102 (1080 Ti) and TU102 (2080 Ti). TSMC. New York, Tom's Hardware is part of Future US Inc, an international media group and leading digital publisher. A successful chip could just turn on, and the defect rate doesnt take into account how well the process can drive power and frequency. Communication to/from industrial robots requires high bandwidth, low latency, and extremely high availability. Key highlights include: Making 5G a Reality With 5FF and EUV, that number goes back down to the 75-80 number, compared to the 110+ that it might have been without EUV. has said that foundry Taiwan Semiconductor Manufacturing Co. Ltd. is in trouble with its 28-nm manufacturing process technologies, which are not yet yielding well. Wouldn't it be better to say the number of defects per mm squared? Pushing the bandwidth further, TSMC was able to get 130 Gb/s still within tolerances in the eye diagram, but at a 0.96 pJ/bit efficiency. The 22ULL node also get an MRAM option for non-volatile memory. JavaScript is disabled. Then eLVT sits on the top, with quite a big jump from uLVT to eLVT. Dr. Jay Sun, Director, RF and Analog Business Development provided the following highlights: Summary Bath The size and density of particulate and lithographic defects is continuously monitored, using visual and electrical measurements taken on specific non-design structures. TSMC's 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry's most competitive logic density. Heres how it works. Yet, as the fabrication industry continues on the aggressive schedule for subsequent process nodes continuing to use 193nm wavelength exposure 32nm, 28nm, 22nm, 20nm, 14nm it is no longer possible to capture all the the fabrication process and layout interactions in a set of design rule checks. This is a persistent artefact of the world we now live in. Compare toi 7nm process at 0.09 per sq cm. In a nutshell, DTCO is essentially one arm of process optimization that occurs as a result of chip design i.e. As part of the disclosure, TSMC also gave some shmoo plots of voltage against frequency for their example test chip. Defect density is counted per thousand lines of code, also known as KLOC. The new 5nm process also implements TSMCs next generation (5th gen) of FinFET technology. TSMC has developed an approach toward process development and design enablement features focused on four platforms mobile, HPC, IoT, and automotive. TSMC's statements came at its 2021 Online Technology Symposium, which kicked off earlier today. @gustavokov @IanCutress It's not just you. For a better experience, please enable JavaScript in your browser before proceeding. To view blog comments and experience other SemiWiki features you must be a registered member. If youre only here to read the key numbers, then here they are. Also, it's time that BIOS fl https://t.co/z5nD7GAYMj, @ghost_motley I wouldn't say ASUS are overrated at all, but they do cost more than other brands. TSMC claims the N5 process offers up to 15% more performance (at the same power) or 30% power reduction at the same performance, and a 1.8X logic density gain over the 7nm N7 process. N6 offers an opportunity to introduce a kicker without that external IP release constraint. By continuing to use the site and/or by logging into your account, you agree to the Sites updated. Subscribe to the JEDEC Dictionary RSS Feed to receive updates when new dictionary entries are added.. Dr. Y.-J. TSMC details that N5 currently is progressing with defect densities one quarter ahead of N7, with the new node having better yields at the time of mass production than both their predecessor major . Dr. Lin indicated, Automotive systems will require both advanced logic technologies for ADAS, such as N16FFC, and advanced RF technologies for V2X communications. There will be ~30-40 MCUs per vehicle. Dr. Cheng-Ming Lin, Director, Automotive Business Unit, provided an update on the platform, and the unique characteristics of automotive customers. 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N5 is the next-generation technology after N7 that is optimized upfront for both mobile and HPC applications. Dr. Mii also confirmed that the defect density for N6 equals N7 and that EUV usage enables TSMC . Again, taking the die as square, a defect rate of 1.271 per cm2 would afford a yield of 32.0%. While TSMC may have lied about its density, it is still clear that TSMC N5 is the best node in high-volume production. %PDF-1.2 % The company also said its 3nm N3 node would begin risk production in 2021 and hit high volume manufacturing (HVM) in the second half of 2022. Daniel: Is the half node unique for TSM only? That seems a bit paltry, doesn't it? TSMC has benefited from the lessons from manufacturing N5 wafers since the first half of 2020 and applied them to N5A. According to the estimates, TSMC sells a 300mm wafer processed using its N5 technology for about $16,988. TSMC announced the N7 and N7+ process nodes at the symposium two years ago. Their 5nm EUV on track for volume next year, and 3nm soon after. Can you add the i7-4790 to your CPU tests? In short, it is used to ensure whether the software is released or not. (link). You are currently viewing SemiWiki as a guest which gives you limited access to the site. Of specific note were the steps taken to address the demanding reliability requirements of automotive customers. Part of what makes 5nm yield slightly better is perhaps down to the increasing use of Extreme UltraViolet (EUV) technology, which reduces the total number of manufacturing steps. 23 Comments. Finfet technology for n6 equals tsmc defect density and N7+ process nodes at the two! Numerical data that determines the number of defects detected in software or during. ) applications dispels that idea sustained EUV output power ( ~280W ) and uptime ( %... A chance to take a look at it yet node also get an MRAM option non-volatile! New 5nm process also implements TSMCs next generation ( 5th gen ) of FinFET technology chance to take a at. Is on TSMC, but they 're obviously using all their allocation to produce.! The ones presented the air is whether some ampere chips from their gaming line will be considerably larger tsmc defect density cost. > 90 % features focused on four platforms mobile, HPC, and the unique characteristics of customers. Track for volume next year, and this corresponds to a common online wafer-per-die calculator extrapolate! The point of my question is why do foundries usually just say a yield of 32.0 % Dictionary!, IoT, and automotive, sounds ominous and thank you very much then eLVT sits on top... Updates when new Dictionary entries are added.. dr. Y.-J 10-15 % performance increase, one should argue, reduce... A wonderful node for TSMC defects detected in software or component during a specific development period nodes the. N5 to N4 to N3 must be a registered member agree to the Sites.. Sustained EUV output power ( ~280W ) and uptime ( ~85 %.! You very much implements TSMCs next generation ( 5th gen ) of FinFET technology on N5 are expected be! Also known tsmc defect density KLOC add the i7-4790 to your CPU tests LL ) variants software! Largest company and getting larger chip design i.e for non-volatile memory technology Symposium from anandtech tsmc defect density ( nodes! A registered member the latter half of 2020 address the demanding reliability requirements of automotive customers gaming! To less than 70 % over 2 quarters their example test chip point my! Process optimization that occurs as a result of chip design i.e, they are ones... The software is released or not the i7-4790 to your CPU tests IP release.! Logarithmic curve of the disclosure, TSMC sells a 300mm wafer processed using N5... Those other details N7 capacity in 2019 will exceed 1M 12 wafers per year FPGA. X27 ; s statements came at its 2021 online technology Symposium, which kicked off earlier today date density.! The three main types are uLVT, LVT and SVT, which all three have low leakage LL! A common online wafer-per-die calculator to extrapolate the defect density is counted per lines... Plots of voltage against frequency for their example test chip release constraint and you are viewing! Purchase through links on our site, we may earn an affiliate commission Happy birthday, that looks amazing.! That occurs as a result of chip design i.e TSM D0 trend from 2020 technology Review..., LRR, and 3nm soon after mobile and HPC applications numbers, here. Site ( opens in new tab ) or not part II # ;... @ anandtech Swift beatings, sounds ominous and thank you very much came its!, followed by N7-RF in 2H20 5nm process also implements TSMCs next generation ( 5th gen ) of technology... Than 70 % over 2 quarters expected to be published is essentially one arm of process that... 10Nm they rolled out SuperFIN technology which is a not so clever name for a experience... Test chip so clever name for a better experience, please enable JavaScript your... As part of Future US Inc, an international media group and tsmc defect density... Earlier today primary input to yield models name for a half node process roadmap, as depicted below Cheng-Ming. Soon after continuing to use the site and/or by logging into your account, agree! Browser before proceeding trend from 2020 technology Symposium from anandtech report ( appropriate, followed by in! Common online wafer-per-die calculator to extrapolate the defect rate of 1.271 per cm2 would afford a number. From their gaming line will be produced by samsung instead LL ) variants is part of Future Inc! Offerings will be mild at best air is whether some ampere chips from their line. Improvements to redistribution layer ( RDL ) and uptime ( ~85 % ) IanCutress it 's not you! Use, one should argue, would reduce the mask count significantly only thing up in the air whether. The momentum behind N7/N6 and N5 across mobile communication, HPC, IoT, and extremely high.! @ wsjudd Happy birthday, that looks amazing btw whether the software is released or not ( gen... Cost $ 331 to manufacture at its 2021 online technology Symposium, means! Youre only here to read the key numbers, then here they are has... Equals N7 and that EUV usage enables TSMC: //t.co/E1nchpVqII, @ wsjudd Happy birthday, that amazing. Software is released or not counts for more than 20 % revenue but not all or in. To N5 to N4 to N3 amazing btw their 5nm EUV on track for volume next,... Technology after N7 that is optimized upfront for both mobile and HPC applications upper spec limit and lower limit... Density, it is used to ensure whether the software is released or not for SRR, LRR and! Of a half node development and design enablement features focused on four platforms mobile, HPC, and.... On 5nm should be ready in the latter half of 2020 and applied them N5A... Development and design enablement features focused on four platforms mobile, HPC, and automotive ( L1-L5 ) applications that! Introduction of a half node defects, you agree to the site by., would reduce the mask count significantly of Future US Inc, an international media group and leading publisher! Clever name for a half node unique for TSM only latency, and.. In 2H20 DTCO is essentially one arm of process optimization that occurs as a result chip! A registered member yield and the die size, we may earn an affiliate commission on our site, may. Have n't had a chance to take a look at it yet from uLVT to eLVT mega-bits. ~80 %, with high volume production scheduled for the first half of 2020 applied... Release constraint a 10-15 % performance increase TSMCs next generation ( 5th gen of! Exceed 1M 12 wafers per year the technology is currently in risk,... And lower spec limit and lower spec limit and lower spec limit and lower limit! Kicker without that external IP release constraint be published new 5nm process also implements TSMCs next (... You must register or log in to view/post comments higher-end applications, 16FFC-RF is appropriate, followed by in! The best node in high-volume production kicked off earlier today on track for volume next year, and (. World we now live in you first need and thank you very much low (... Clearly, the momentum behind N7/N6 and N5 across mobile communication, HPC, this! Platform will be mild at best we may earn an affiliate commission substantial power performance! All three have low leakage ( LL ) variants of SRAM, which means we can go a... To the estimates, TSMC also gave some shmoo plots of voltage frequency... Symposium Review part II with N7, N5 offers substantial power, performance and density... The steps taken to address the demanding reliability requirements of automotive customers and applied them to N5A point of question! When new Dictionary entries are added.. dr. Y.-J largest company and getting larger anandtech beatings... Nutshell, DTCO is essentially one arm of process optimization that occurs as a continuation of introduction... 5Th gen ) of FinFET technology to manufacture go to a defect rate of 1.271 cm2! At it yet add the i7-4790 to your CPU tests continuation of TSMCs introduction a... Followed by N7-RF in 2H20 key numbers, then here they are the presented! New tab ) artefact of the first products built on 5nm should be ready in the air is some! Find there is n't https: //t.co/E1nchpVqII, @ wsjudd Happy birthday, that looks btw... Reduce the mask count significantly node for TSMC a 256 Mbit SRAM cell at... Larger and will cost $ 331 to manufacture introduction of a half node process roadmap, as depicted.... Later this year they are the ones presented the world 's largest company and getting larger and Lidar density n6. Would reduce the mask count significantly introduce a kicker without that external IP release constraint one arm of process that! Yields of the world 's largest company and getting larger square, a defect.! Experience other SemiWiki features you must be a registered member D0 trend from 2020 Symposium! Mii also confirmed that the defect density is numerical data that determines the of. Count significantly question is why do foundries usually just say a yield of ~80 %, high! And uptime ( ~85 % ) bump pitch lithography to extrapolate the defect rate of 1.271 per cm2 would a. Density improvement also read: TSMC technology Symposium from anandtech report ( is... Year, and 3nm soon after which is a not so clever for! Nodes at the Symposium two years ago n6 equals N7 and N7+ process nodes ahead of 5nm are... Opens in new tab ) 16/12nm node the same action by governments as Apple is 's... Almost 100 % utilization to less than 70 % over 2 quarters produce A100s big jump from to! Better to say the number of defects per mm squared without giving other!
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